MANUFACTURER: AM TECHNOLOGY CO.,LTD. (www.amtechonology.co.kr)  
     
  SEMI-CONDUCTOR INDUSTRY  
  ::CMP Machine:: (download)  
     
    POLI 400  
     
 
       
         
  POLI-400 model is high reliability CMP tester which improves from POLI-380 with easy handling and
low cost of ownership. This equipment ensure more effective process development. The dramatically
reduced time of process development allows for a much faster time-to-research and market.
Features
 
Desk-top CMP Machine for R & D
Stable repeatability (WTWNU < 5%)
High rigidity, High flatness
Head Oscillation (-25mm ~ +25mm)
Two supply systems (DIW + Slurry)
Specification
 
Head, Table : Rotational motion
Size : 740W 890D 760H mm
Workpiece : Max 6 inch Wafer or MEMS Structure Surface or Coupon Wafer
Table Size : 400mm
Pressing Method : Air pressing by electric air regulator  (range 60 ~ 700g/cm2 for 4”)
Head Type : 4 inch type, 6 inch type, Required type  (Changeable)
Process : Automatic Sequence, Dry-in / Wet-out
PLC Control (under developing PC Control)
Conditioner: Ring type diamond Conditioner (attachable to head)
Head/Table Velocity : max 100rpm
Head Oscillation
   
 
Model POLI-400
Platen Diameter Φ 400mm
Platen Speed 0-200 rpm
Wafer Size Max φ 150 mm
Work Head Speed 0-200 rpm
Pressure 100 g/cm²~ 700 g/cm²
Dimension (WxDxH) 700x920x990 (mm)
Weight 400kg
 
     
     
    POLI-500  
     
 
       
         
 
 
POLI-500 model can be applicable up to 200mm wafer as well as coupon, 100mm and 150mm
wafer. Automatic process and in-situ conditioning realize most similar process with actual CMP
process. This equipment ensure a very effective process, consumable development and research.
The dramatically reduced time of research or development allows for a much faster time-to-research
and market.
Features
 
200mm CMP Machine for R & D
Stable repeatability (WTWNU < 5%)
Applicable from coupon wafer to 200mm
In-situ or ex-situ conditioning
Semi-pneumatic pressing method
High rigidity, High flatness
Specification
 
Head, Table : Rotational motion
Size : 740W 890D 760H mm
Workpiece : Max 6 inch Wafer or MEMS Structure  Surface or Coupon Wafer
Table Size : 400mm
Pressing Method : Air pressing by electric air regulator (range 60 ~ 700g/cm2 for 4”)
Head Type : 4 inch type, 6 inch type, Required type (Changeable)
Process : Automatic Sequence, Dry-in / Wet-out
PLC Control (under developing PC Control)
Conditioner: Ring type diamond Conditioner (attachable to head)
Head/Table Velocity : max 100rpm
Head Oscillation
Metal CMP applicable
   
 
Model POLI-500
Platen Diameter Φ 500mm
Platen Speed 0-90 rpm
Wafer Size φ 100 mm, φ 200 mm
Work Head Speed 0-90 rpm
Pressure 100 g/cm²~ 500 g/cm²
Dimension (WxDxH) 700x920x990 mm
Weight 400kg
   
   
 
     
     
    POLI-1200  
     
 
       
         
 
Can be applicable to CMP of wafer. Automatic process and in-situ conditioning Realize most similar
process with actual CMP process. This equipment ensure a Very effective process, consumable
development and research. The dramatically Reduced time of research and market.
Features
 
200mm Wafer CMP Machine
Stable Repeatability
Applicable form coupon wafer to 200mm wafer
in-situ of ex-situ conditioning
Self-weight pressing method (Semi-pneumatic pressing method)
High Rigidity
High Flatness
Specification
 
Model POLI-1200
Wafer Size Φ 1200mm
Wheel Driving Motor 11kW, 0~90rpm
Condition Ring Φ 560 mm
Max Pressure 120 kg/bar
Dimension (WxDxH) 1,800x1,530x2,150 (mm)
Weight 2,800kg
 
     
     
  Copyright © 2009 Young Han Hi-Tech Sdn Bhd (Co. No. 763364-T) . Web Site Designed By NetBusiness Solution