MANUFACTURER: AM TECHNOLOGY CO.,LTD. (www.amtechonology.co.kr)  
     
  SEMI-CONDUCTOR INDUSTRY  
  ::Wafer Back Grinding:: (download)  
     
 
FEATURES
 
Safe, Clean and Fast grinding
Maintenance Free
Easy Operation
High Accuracy
   
APPLICATION
 
Back grinding of MR Head Wafer
Sizing of Air Bag Sensor
Surface Grinding of Video Head Block
Surface Grinding of Hard Material Specimens
Surface Grinding of FDD Head Slider
Sizing of Resonator Filter
Chamfering of OLPF for Camcorder
   
 
    HRG-150/150F  
     
 
     
         
SPECIFICATION
 
Model HRG-150 HRG-150F
Wheel Spindle 1.5kW 3,000rpm 5.5kW 3,000rpm
Work Spindle 0.2kW 400rpm 1.5kW 400rpm
Max Workpiece Size Φ 150 mm Φ 200 mm
Travel Length 70 mm 70 mm
Feed Rate 0.01 ~5 mm/min 0.01 ~5 mm/min
Resolution 0.001 mm 0.001 mm
Accuracy ± 2㎛ ± 2㎛
Repeatability ± 1㎛ ± 1㎛
Dimension (WxDxH) 1,070 x 500 x 1,460 (mm) 1,070 x 500 x 1,460 (mm)
Weight 700 kg 1,200 kg
 
     
     
    VRG-250  
     
 
   
         
SPECIFICATION
 
Model VRG-250
Wheel Spindle 3.75kW 3,000rpm
Work Spindle 0.37kW 200rpm
Max Workpiece Size Φ 250
Travel Length 100 mm
Feed Rate 0.01 ~ 10 mm/min
Resolution 0.001 mm
Accuracy ± 2㎛
Repeatability ± 1㎛
Dimension (WxDxH) 1,100 x 950 x 1,970 mm
Weight 1,450 kg
 
     
     
    VRG-400/500  
     
 
     
         
SPECIFICATION
 
Model VRG-400/500
Wheel Spindle 7.5kW 3,000rpm
Work Spindle 1.5kW 200rpm
Max Workpiece Size Φ 500
Travel Length 200 mm
Feed Rate 0.01 ~ 10 mm/min
Resolution 0.001 mm
Accuracy ± 2㎛
Repeatability ± 1㎛
Dimension (WxDxH) 1,300 x 1,400 x 2,100 (mm)
Weight 2,000 kg
 
     
     
  Copyright © 2009 Young Han Hi-Tech Sdn Bhd (Co. No. 763364-T) . Web Site Designed By NetBusiness Solution